AM1808_12 Datasheet, PDF (257/262 Pages) Texas Instruments – ARM Microprocessor

AM1808
www.ti.com
SPRS653C – FEBRUARY 2010 – REVISED DECEMBER 2011
Table 7-2. Thermal Resistance Characteristics (PBGA Package) [ZWT] (continued)
NO.
°C/W ⁽¹⁾
AIR FLOW (m/s)⁽²⁾
4
21.0
0.50
5
6
RΘ_JMA
Junction-to-moving air
20.1
1.00
19.3
2.00
7
18.4
4.00
8
0.2
0.00
9
0.3
0.50
10 Psi_JT
11
Junction-to-package top
0.3
1.00
0.4
2.00
12
0.5
4.00
13
12.3
0.00
14
12.2
0.50
15 Psi_JB
16
Junction-to-board
12.1
1.00
12.0
2.00
17
11.9
4.00
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Mechanical Packaging and Orderable Information 257
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