LP38691-ADJ_16 Datasheet, PDF (20/27 Pages) Texas Instruments – 500-mA Low-Dropout CMOS Linear Regulators Stable

LP38691-ADJ, LP38693-ADJ, LP38691-ADJ-Q1, LP38693-ADJ-Q1
SNVS324K – JANUARY 2005 – REVISED JANUARY 2016
11 Device and Documentation Support
www.ti.com
11.1 Documentation Support
11.1.1 Related Documentation
For related documentation see the following:
• Leadless Leadframe Package (LLP) (SNOA401)
• Semiconductor and IC Package Thermal Metrics (SPRA953)
• Using New Thermal Metrics (SBVA025)
• Thermal Characteristics of Linear and Logic Packages Using JEDEC PCB Designs (SZZA017)
11.2 Related Links
Table 2 lists quick access links. Categories include technical documents, support and community resources,
tools and software, and quick access to sample or buy.
PARTS
LP38691-ADJ
LP38693-ADJ
LP38691-ADJ-Q1
LP38693-ADJ-Q1
PRODUCT FOLDER
Click here
Click here
Click here
Click here
Table 2. Related Links
SAMPLE & BUY
Click here
Click here
Click here
Click here
TECHNICAL
DOCUMENTS
Click here
Click here
Click here
Click here
TOOLS &
SOFTWARE
Click here
Click here
Click here
Click here
SUPPORT &
COMMUNITY
Click here
Click here
Click here
Click here
11.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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Product Folder Links: LP38691-ADJ LP38693-ADJ LP38691-ADJ-Q1 LP38693-ADJ-Q1