THS3092_14 Datasheet, PDF (2/45 Pages) Texas Instruments – HIGH-VOLTAGE, LOW-DISTORTION, CURRENT-FEEDBACK OPERATIONAL AMPLIFIERS

THS3092
THS3096
SLOS428B – DECEMBER 2003 – REVISED FEBRUARY 2006
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
TOP VIEW
D, DDA
1V_OUT
1V_{IN −}
1V_{IN +}
V_S−
THS3092
1
8
2
7
3
6
4
5
V_S+
2V_OUT
2V_IN−
2V_IN+
NC = No Internal Connection
TOP VIEW
D, PWP
THS3096
1V_OUT
1
14
1V_IN−
2
13
1V_IN+
3
12
V_S−
4
11
NC
5
10
REF 6
9
NC
7
8
NC = No Internal Connection
See Note A.
V_S+
2V_OUT
2V_IN−
2V_IN+
NC
PD
NC
Note A: The devices with the power down option defaults to the ON state if no signal is applied to the PD pin. Additionallly, the REF pin
functional range is from V_S− to (V_S+ − 4 V).
PART NUMBER
THS3092D
THS3092DR
THS3092DDA
THS3092DDAR
Power-down
THS3096D
THS3096DR
THS3096PWP
THS3096PWPR
ORDERING INFORMATION
PACKAGE TYPE
SOIC-8
SOIC-8-PP ⁽¹⁾
TRANSPORT MEDIA, QUANTITY
Rails, 75
Tape and Reel, 2500
Rails, 75
Tape and Reel, 2500
SOIC-8
TSSOP-14-PP ⁽¹⁾
Rails, 75
Tape and Reel, 2500
Rails, 90
Tape and Reel, 2000
(1) The PowerPAD is electrically isolated from all other pins.
DISSIPATION RATING TABLE
PACKAGE
D-8
DDA-8 ⁽³⁾
PWP-14 ⁽³⁾
Θ_JC (°C/W)
38.3
9.2
2.07
Θ_JA (°C/W)⁽¹⁾
97.5
45.8
37.5
POWER RATING⁽²⁾
T_A≤ 25°C
1.02 W
T_A = 85°C
410 mW
2.18 W
873 mW
2.67 W
1.07 W
(1) This data was taken using the JEDEC standard High-K test PCB.
(2) Power rating is determined with a junction temperature of 125°C. This is the point where distortion starts to substantially increase.
Thermal management of the final PCB should strive to keep the junction temperature at or below 125°C for best performance and long
term reliability.
(3) The THS3092 and THS3096 may incorporate a PowerPAD™ on the underside of the chip. This acts as a heatsink and must be
connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction
temperature which could permanently damage the device. See TI Technical Brief SLMA002 for more information about utilizing the
PowerPAD™ thermally enhanced package.
2
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