OPA2691 Datasheet, PDF (2/30 Pages) Texas Instruments – Dual Wideband, Current-Feedback OPERATIONAL AMPLIFIER

PACKAGE/ORDERING INFORMATION⁽¹⁾
PRODUCT
OPA2691
"
OPA2691
"
PACKAGE-LEAD
SO-8
"
SO-14
"
PACKAGE
DESIGNATOR
D
"
D
"
SPECIFIED
TEMPERATURE
RANGE
–40°C to +85°C
"
–40°C to +85°C
"
PACKAGE
MARKING
OPA2691
"
OPA2691
"
ORDERING
NUMBER
OPA2691ID
OPA2691IDR
OPA2691I-14D
OPA2691I-14DR
TRANSPORT
MEDIA, QUANTITY
Rails, 100
Tape and Reel, 2500
Rails, 58
Tape and Reel, 2500
NOTE: (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at
www.ti.com.
ABSOLUTE MAXIMUM RATINGS⁽¹⁾
Power Supply ............................................................................... ±6.5V_DC
Internal Power Dissipation⁽²⁾ ............................ See Thermal Information
Differential Input Voltage .................................................................. ±1.2V
Input Voltage Range ........................................................................... ±V_S
Storage Temperature Range: D, 14D ............................ –65°C to +125°C
Lead Temperature (soldering, 10s) .............................................. +300°C
Junction Temperature (T_J ) ........................................................... +175°C
ESD Performance:
HBM .............................................................................................. 2000V
CDM .............................................................................................. 1500V
NOTES: (1) Stresses above those listed under “Absolute Maximum Ratings”
may cause permanent damage to the device. Exposure to absolute maximum
conditions for extended periods may affect device reliability. (2) Packages
must be derated based on specified θ_JA. Maximum T_J must be observed.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
PIN CONFIGURATIONS
Top View
Out A 1
–In A 2
+In A 3
–V_S 4
8 +V_S
7 Out B
6 –In B
5 +In B
–In A 1
+In A 2
DIS A 3
–V_S 4
DIS B 5
+In B 6
–In B 7
14 Out A
13 NC
12 NC
11 +V_S
10 NC
9 NC
8 Out B
NC = No Connection
SO-8
SO-14
2
OPA2691
www.ti.com
SBOS224D