ADS58H40_14 Datasheet, PDF (2/60 Pages) Texas Instruments – Quad-Channel, 250-MSPS Receiver and Feedback ADC

ADS58H40
SBAS589B – AUGUST 2012 – REVISED NOVEMBER 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PRODUCT
ADS58H40
PACKAGE AND ORDERING INFORMATION⁽¹⁾
PACKAGE-
PACKAGE
SPECIFIED
TEMPERATURE
LEAD DESIGNATOR
RANGE
ECO PLAN⁽²⁾
LEAD AND
BALL
FINISH
PACKAGE
MARKING
BGA-144
ZCR
–40°C to +85°C
GREEN (RoHS,
no SB or BR)
CuNiPdAu
ADS58H40I
ORDERING
NUMBER
ADS58H40IZCR
ADS58H40IZCRR
TRANSPORT
MEDIA
Tray
Tape and Reel
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
(2) These packages conform to Lead (Pb)-free and green manufacturing specifications. Additional details including specific material content
can be accessed at www.ti.com/leadfree.
GREEN: TI defines Green to mean Lead (Pb)-Free and in addition, uses less package materials that do not contain halogens, including
bromine (Br), or antimony (Sb) above 0.1% of total product weight.
N/A: Not yet available Lead (Pb)-Free; for estimated conversion dates, go to www.ti.com/leadfree.
Pb-FREE: TI defines Lead (Pb)-Free to mean RoHS compatible, including a lead concentration that does not exceed 0.1% of total
product weight, and, if designed to be soldered, suitable for use in specified lead-free soldering processes.
ABSOLUTE MAXIMUM RATINGS⁽¹⁾
Over operating free-air temperature range, unless otherwise noted.
Supply voltage range
Voltage between
Voltage applied to input pins
Temperature
Electrostatic discharge (ESD)
ratings
AVDD33
AVDD
DRVDD
AVSS and DRVSS
AVDD and DRVDD
AVDD33 and DRVDD
AVDD33 and AVDD
XINP, XINM
CLKP, CLKM⁽²⁾
RESET, SCLK, SDATA, SEN, SNRB, TRIG_EN, PDN
Operating free-air, T_A
Operating junction, T_J
Storage, T_stg
Human body model (HBM)
VALUE
–0.3 to +3.6
–0.3 to +2.1
–0.3 to +2.1
–0.3 to +0.3
–2.4 to +2.4
–2.4 to +3.9
–2.4 to +3.9
–0.3 to minimum (1.9, AVDD + 0.3)
–0.3 to minimum (1.9, AVDD + 0.3)
–0.3 to +3.9
–40 to +85
+150
–65 to +150
2
UNIT
V
V
V
V
V
V
V
V
V
V
°C
°C
°C
kV
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
(2) When AVDD is turned off, TI recommends switching off the input clock (or ensuring the voltage on CLKP and CLKM is less than
| 0.3 V |). This recommendation prevents the ESD protection diodes at the clock input pins from turning on.
2
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