LP2997 Datasheet, PDF (17/21 Pages) National Semiconductor (TI) – DDR-II Termination Regulator

DDA0008A
A
1
5.0
4.8
NOTE 3
4
B
PACKAGE OUTLINE
PowerPAD^TM SOIC - 1.7 mm max height
SCALE 2.400
PLASTIC SMALL OUTLINE
6.2
5.8
TYP
PIN 1 ID
AREA
6X 1.27
8
C
SEATING PLANE
0.1 C
2X
3.81
4.0
3.8
NOTE 4
5
8X
0.51
0.31
0.25 C A B
1.7 MAX
SEE DETAIL A
0.25
0.10
TYP
4
2.34
2.24
5
EXPOSED
THERMAL PAD
0.25
GAGE PLANE
0.15
1
8
0 -8
1.27
0.00
0.40
DETAIL A
2.34
TYPICAL
2.24
NOTES:
4218825/A 05/2016
PowerPAD is a trademark of Texas Instruments.
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MS-012.
www.ti.com