BQ29209-Q1 Datasheet, PDF (17/23 Pages) Texas Instruments – Voltage Protection with Automatic Cell Balance

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DRB0008F
bq29209-Q1
SLUSC62A – JUNE 2015 – REVISED MARCH 2016
EXAMPLE BOARD LAYOUT
VSON - 1 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
8X (0.6)
1
8X (0.3)
6X (0.65)
4
(R0.05) TYP
( 0.2) VIA
TYP
(1.6)
SYMM
8
(0.55)
(2.8)
LAND PATTERN EXAMPLE
SCALE:20X
(2.4)
(0.95)
5
0.07 MAX
ALL AROUND
0.07 MIN
ALL AROUND
SOLDER MASK
OPENING
METAL
NON SOLDER MASK
DEFINED
(PREFERRED)
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4222121/A 11/2015
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If some or all are implemented, recommended via locations are shown.
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