English
Language : 

BQ29209-Q1 Datasheet, PDF (16/23 Pages) Texas Instruments – Voltage Protection with Automatic Cell Balance
bq29209-Q1
SLUSC62A – JUNE 2015 – REVISED MARCH 2016
DRB0008F
A
SCALE 4.000
3.1
B
2.9
www.ti.com
PACKAGE OUTLINE
VSON - 1 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
PIN 1 INDEX AREA
3.1
2.9
(0.08)
(0.05)
SECTION A-A SECTIONA-A
SCALE 30.000
TYPICAL
1 MAX
0.05
0.00
C
SEATING PLANE
0.08 C
EXPOSED
THERMAL PAD
4
2X
1.95
1.6±0.1
5
A
A
2.4±0.1
(0.2) TYP
1
6X 0.65
PIN 1 ID
(OPTIONAL)
8X
0.5
0.3
8
8X
0.35
0.25
0.1 C A B
0.05 C
4222121/A 11/2015
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
16
Submit Documentation Feedback
www.ti.com
Product Folder Links: bq29209-Q1
Copyright © 2015–2016, Texas Instruments Incorporated