LMH2180_14 Datasheet, PDF (16/22 Pages) Texas Instruments – 75 MHz Dual Clock Buffer

PACKAGE OPTION ADDENDUM
www.ti.com
24-Jan-2013
PACKAGING INFORMATION
Orderable Device
LMH2180SD/NOPB
LMH2180SDE/NOPB
LMH2180SDX/NOPB
LMH2180TM/NOPB
LMH2180TMX/NOPB
LMH2180YD/NOPB
LMH2180YDX/NOPB
Status Package Type Package Pins Package Qty
(1)
Drawing
Eco Plan Lead/Ball Finish MSL Peak Temp
(2)
(3)
Op Temp (°C) Top-Side Markings
(4)
ACTIVE
WSON
NGQ 8
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM -40 to 85 2180S
ACTIVE
WSON
NGQ 8
250
Green (RoHS
CU SN
Level-1-260C-UNLIM -40 to 85 2180S
& no Sb/Br)
ACTIVE
WSON
NGQ 8
4500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM -40 to 85 2180S
ACTIVE DSBGA
YFQ 8
250
Green (RoHS SNAGCU Level-1-260C-UNLIM
A
& no Sb/Br)
ACTIVE DSBGA
YFQ 8
3000
Green (RoHS SNAGCU Level-1-260C-UNLIM
A
& no Sb/Br)
ACTIVE
SON
NGW 8
1000
Green (RoHS CU SNAGCU Level-1-260C-UNLIM
& no Sb/Br)
-40 to 85 2180Y
ACTIVE
SON
NGW 8
4500
Green (RoHS CU SNAGCU Level-1-260C-UNLIM
& no Sb/Br)
-40 to 85 2180Y
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Samples
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) _{MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.}
(4) _{Only one of markings shown within the brackets will appear on the physical device.}
Addendum-Page 1