5962-9865201QFA Datasheet, PDF (12/16 Pages) Texas Instruments – DS90LV032AQML 3V LVDS Quad CMOS Differential Line Receiver

PACKAGE OPTION ADDENDUM
www.ti.com
16-Apr-2013
PACKAGING INFORMATION
Orderable Device
5962-9865201QFA
Status Package Type Package Pins Package
(1)
Drawing
Qty
ACTIVE
CFP
NAD 16
19
Eco Plan
(2)
TBD
Lead/Ball Finish
Call TI
MSL Peak Temp
(3)
Call TI
Op Temp (°C)
-55 to 85
DS90LV032AW-MLS
ACTIVE
CFP
DS90LV032AW-QML
ACTIVE
CFP
NAD 16
19
NAD 16
19
TBD
TBD
Call TI
Call TI
Call TI
Call TI
-55 to 85
-55 to 85
DS90LV032AWGMLS
ACTIVE
CFP
NAC 16
42
TBD
Call TI
Call TI
-55 to 85
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Top-Side Markings
(4)
(DS90LV031AW ~
DS90LV032AW)
-QML Q
(5962-98651 ~
5962-98652)
01QFA ACO
01QFA >T
DS90LV032AW-
MLS ACO
MLS >T
(DS90LV031AW ~
DS90LV032AW)
-QML Q
(5962-98651 ~
5962-98652)
01QFA ACO
01QFA >T
(DS90C032WGL ~
DS90LV032AWG)
MLS ACO
MLS >T
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Samples
Addendum-Page 1