DS15MB200_13 Datasheet, PDF (11/18 Pages) Texas Instruments – Dual 1.5 Gbps 2:1/1:2 LVDS Mux/Buffer with Pre-Emphasis

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15MB200
DS15MB200
SNLS196E – NOVEMBER 2005 – REVISED MARCH 2013
V_DD
0.1 PF
R1
R2
83: 83:
50:
LVPECL
50:
0.1 PF
R3
R4
130: 130:
Figure 11. AC Coupled LVDS to LVPECL Interface
Figure 11 illustrates AC coupled interface between an LVDS driver and LVPECL receiver without a V_T pin
available. The resistors R1, R2, R3, and R4, if not present in the receiver⁽²⁾, provide a load for the driver,
terminate the transmission line, and bias the signal for the receiver.
Packaging Information
The Leadless Leadframe Package (WQFN) is a leadframe based chip scale package (CSP) that may enhance
chip speed, reduce thermal impedance, and reduce the printed circuit board area required for mounting. The
small size and very low profile make this package ideal for high density PCBs used in small-scale electronic
applications such as cellular phones, pagers, and handheld PDAs. The WQFN package is offered in the no
Pullback configuration. In the no Pullback configuration the standard solder pads extend and terminate at the
edge of the package. This feature offers a visible solder fillet after board mounting.
The WQFN has the following advantages:
• Low thermal resistance
• Reduced electrical parasitics
• Improved board space efficiency
• Reduced package height
• Reduced package mass
For more details about WQFN packaging technology, refer to applications note AN-1187, "Leadless Leadframe
Package" (SNOA401).
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