LP3925 Datasheet, PDF (10/51 Pages) Texas Instruments – High Performance Power Management Unit for Handset Applications

Symbol
Parameter
LOGIC AND CONTROL OUTPUTS
V_OL
Output Low Level
V_OH
Output High Level
I_OH
Output High Leakage
Conditions
Typ
RSTOUT_N, RCV, DATA/VP, SEO/
VM, IRQ_N
I_OUT = 2mA
SDA (Note 7)
RCV, DATA/VP, SEO/VM
I_OUT = 2mA
SDA (Note 7), RSTOUT_N, IRQ_N
VOH = V_LDO1
Limits
Min
Max
Units
0.25*
V_LDO1
V
0.25*
V_LDO1
0.75*
V_LDO1
V
10
µA
Current Consumption
Current consumption of the LP3925 PMU has been one of the
main features this device is famous for. It is mainly because
of ultra low I_Qs in sleep and standby modes the LP3925 can
ensure dramatic power savings and prolong battery life for
enormous amount of time. Due to such a significant advan-
tage in these critical factors, an LP3925 is very convenient to
use in innovative and environmentally friendly designs, giving
the end user the possibility of increased consumer device
working time and thus a crucial advantage of the rapidly de-
veloping mobile market.
The quiescent currents in standby and sleep modes are stat-
ed in the CURRENT CONSUMPTION ELECTRICAL CHAR-
ACTERISTICS below.
CURRENT CONSUMPTION ELECTRICAL CHARACTERISTICS
Typical values and limits appearing in normal type apply for T_J = 25°C. Limits appearing in boldface type apply over the entire
junction temperature range for operation, T_J = −40°C to +125°C. Unless otherwise specified, the following applies for V_BATT = 3.6V.
(Note 6)
Symbol
Parameter
Conditions
Typ.
Limit
Min
Max
Units
CURRENT CONSUMPTION
I_Q(STANDBY)
Battery Standby Current
V_IN = 3.6V
I_COIN = 0µA
3.5
µA
I_Q(SLEEP)
Battery Current in SLEEP
mode @ 0 load
LDO1 ON
60
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation
of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions,
see the Electrical Characteristics tables.
Note 2: All voltages are with respect to the potential at the GND pin.
Note 3: The Maximum power dissipation depends on the ambient temperature and can be calculated using the formula P = (T_J – T^A)/θ^JA where T_J is the junction
temperature, T_A is the ambient temperature, and θ_JA is the junction-to-ambient thermal resistance. The 1.72W rating appearing under Maximum Ratings results
from substituting the Maximum junction temperature, 125°C, for T_J, 70°C for T_A, and 32°C/W for θ_JA. More power can be dissipated safely at ambient temperatures
below 70°C. Less power can be dissipated safely at ambient temperatures above 70°C. The Maximum power dissipation can be increased by 31 mW for each
degree below 70°C, and it must be de-rated by 31 mW for each degree above 70°C.
Note 4: The Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF capacitor discharged
directly into each pin. MIL-STD-883 3015.7
Note 5: Internal thermal shutdown protects the device from permanent damage. Thermal shutdown engages at T_J = 150°C (typ.) and disengages at T_J=130°C
(typ).
Note 6: All limits are guaranteed. All electrical characteristics having room-temperature limits are tested during production with T_J = 25°C. All hot and cold limits
are guaranteed by correlating the electrical characteristics to process and temperature variations and applying statistical process control.
Note 7: Guaranteed by design.
Note 8: Dropout voltage is the input-to-output voltage difference at which the output voltage is 100 mV below its nominal value. This specification does not apply
in cases it implies operation with an input voltage below the minimum appearing under Operating Ratings. For example, this specification does not apply for
devices having 1.5V outputs because the specification would imply operation with an input voltage at or about 1.5V.
Note 9: Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists,
special care must be paid to thermal dissipation issues in board design.
Note 10: Guaranteed for output voltages no less than 1.0V
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