SN74AUP1G80_16 Datasheet, PDF (1/25 Pages) Texas Instruments – LOW-POWER SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP

SN74AUP1G80
www.ti.com
SCES593E – JULY 2004 – REVISED MAY 2010
LOW-POWER SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP
Check for Samples: SN74AUP1G80
FEATURES
1
• Available in the Texas Instruments NanoStar™
Package
• Low Static-Power Consumption
(I_CC = 0.9 mA Max)
• Low Dynamic-Power Consumption
(C_pd = 4.3 pF Typ at 3.3 V)
• Low Input Capacitance (C_i = 1.5 pF Typ)
• Low Noise – Overshoot and Undershoot <10%
of V_CC
• I_off Supports Partial-Power-Down Mode
Operation
• Schmitt-Trigger Action Allows Slow Input
Transition and Better Switching Noise
Immunity at the Input
(V_hys = 250 mV Typ at 3.3 V)
DBV PACKAGE
(TOP VIEW)
D
1
5
V_CC
CLK
2
• Wide Operating V_CC Range of 0.8 V to 3.6 V
• Optimized for 3.3-V Operation
• 3.6-V I/O Tolerant to Support Mixed-Mode
Signal Operation
• t_pd = 4.4 ns Max at 3.3 V
• Suitable for Point-to-Point Applications
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Performance Tested Per JESD 22
– 2000-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
DCK PACKAGE
(TOP VIEW)
D
1
5
V_CC
CLK
2
GND
3
4Q
GND
3
4
Q
DRY PACKAGE
(TOP VIEW)
D¹
CLK ²
GND ³
6V
CC
5 _NC
4Q
DSF PACKAGE
(TOP VIEW)
D¹
CLK ²
6V
CC
5 _N.C.
GND ³
4_Q
YFP PACKAGE
(TOP VIEW)
D V A1 1 6 A2
CC
CLK B1 2 5 B2 N.C.
GND C1 3 ⁴ C2 Q
YZP PACKAGE
(TOP VIEW)
D V A1 1 5 ^A2
CC
CLK B1 2
GND C1 3 ⁴ C2 Q
See mechanical drawings for dimensions.
N.C. – No internal connection
DESCRIPTION/ORDERING INFORMATION
The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable
applications. This family ensures a very low static- and dynamic-power consumption across the entire V_CC range
of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal
integrity (see Figure 2).
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2010, Texas Instruments Incorporated