ADS6225 Datasheet, PDF (68/75 Pages) Texas Instruments – DUAL CHANNEL, 12-BIT, 125/105/80/65 MSPS ADC WITH SERIAL LVDS INTERFACE

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PACKAGE OPTION ADDENDUM
19-Nov-2007
PACKAGING INFORMATION
Orderable Device
ADS6222IRGZR
ADS6222IRGZRG4
ADS6222IRGZT
ADS6222IRGZTG4
ADS6223IRGZR
ADS6223IRGZRG4
ADS6223IRGZT
ADS6223IRGZTG4
ADS6224IRGZR
ADS6224IRGZRG4
ADS6224IRGZT
ADS6224IRGZTG4
ADS6225IRGZR
ADS6225IRGZRG4
ADS6225IRGZT
ADS6225IRGZTG4
Status ⁽¹⁾
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package
Type
QFN
Package
Drawing
RGZ
QFN
RGZ
QFN
RGZ
QFN
RGZ
QFN
RGZ
QFN
RGZ
QFN
RGZ
QFN
RGZ
QFN
RGZ
QFN
RGZ
QFN
RGZ
QFN
RGZ
QFN
RGZ
QFN
RGZ
QFN
RGZ
QFN
RGZ
Pins Package Eco Plan ⁽²⁾ Lead/Ball Finish MSL Peak Temp ⁽³⁾
Qty
48 2500 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
48 2500 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
48 250 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
48 250 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
48 2500 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
48 2500 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
48 250 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
48 250 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
48 2500 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
48 2500 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
48 250 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
48 250 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
48 2500 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
48 2500 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
48 250 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
48 250 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check}
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Addendum-Page 1