SMJ320C40 Datasheet, PDF (60/62 Pages) Texas Instruments – DIGITAL SIGNAL PROCESSORS

www.ti.com
PACKAGE OPTION ADDENDUM
25-Feb-2005
PACKAGING INFORMATION
Orderable Device
5962-9466902QXA
5962-9466902QXC
5962-9466902QYC
5962-9466903QXA
5962-9466903QXC
5962-9466903QYC
5962-9466904QXA
5962-9466904QYC
SM320C40GFM40
SM320C40GFM50
SM320C40GFS60
SM320C40HFHM40
SM320C40HFHM50
SM320C40HFHS60
SM320C40KGDS50D
SMJ320C40GFM40
SMJ320C40GFM50
SMJ320C40GFS60
SMJ320C40HFHM40
SMJ320C40HFHM50
SMJ320C40HFHS60
Status ⁽¹⁾
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package
Type
CPGA
CPGA
CFP
CPGA
CPGA
CFP
CPGA
CFP
CPGA
CPGA
CPGA
CFP
CFP
CFP
XCEPT
CPGA
CPGA
CPGA
CFP
CFP
CFP
Package
Drawing
GF
GF
HFH
GF
GF
HFH
GF
HFH
GF
GF
GF
HFH
HFH
HFH
KGD
GF
GF
GF
HFH
HFH
HFH
Pins Package Eco Plan ⁽²⁾ Lead/Ball Finish MSL Peak Temp ⁽³⁾
Qty
325 1
None
Call TI
Level-NC-NC-NC
325 1
None
Call TI
Level-NC-NC-NC
352 1
None
Call TI
Level-NC-NC-NC
325 1
None
Call TI
Level-NC-NC-NC
325 1
None
Call TI
Level-NC-NC-NC
352 1
None
Call TI
Level-NC-NC-NC
325 1
None
Call TI
Level-NC-NC-NC
352 1
None
Call TI
Level-NC-NC-NC
325 1
None
Call TI
Level-NC-NC-NC
325 1
None
Call TI
Level-NC-NC-NC
325 1
None
Call TI
Level-NC-NC-NC
352 1
None
Call TI
Level-NC-NC-NC
352 1
None
Call TI
Level-NC-NC-NC
352 1
None
Call TI
Level-NC-NC-NC
0
1
None
Call TI
Level-NC-NC-NC
325 1
None
Call TI
Level-NC-NC-NC
325 1
None
Call TI
Level-NC-NC-NC
325 1
None
Call TI
Level-NC-NC-NC
352 1
None
Call TI
Level-NC-NC-NC
352 1
None
Call TI
Level-NC-NC-NC
352 1
None
Call TI
Level-NC-NC-NC
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional}
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3) _{MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder}
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
Addendum-Page 1