TLC220X Datasheet, PDF (6/62 Pages) Texas Instruments – Advanced LinCMOSE LOW-NOISE PRECISION OPERATIONAL AMPLIFIERS

TLC220x, TLC220xA, TLC220xB, TLC220xY
Advanced LinCMOS™ LOW-NOISE PRECISION
OPERATIONAL AMPLIFIERS
SLOS175 – FEBRUARY 1997
TLC2202Y chip formation
This chip, when properly assembled, displays characteristics similar to the TLC2202C. Thermal compression
or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(8) (7)
80
(1) (2)
100
VDD+
(6)
(8)
1IN + ⁽³⁾ ₊
(1)
(2)
1OUT
1IN –
–
(7)
+
(5)
2IN +
(5)
2OUT
(6)
–
2IN –
(4)
VDD–
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
TJmax = 150°C
(4)
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN MILS.
(3)
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
6
• POST OFFICE BOX 655303 DALLAS, TEXAS 75265