TLC220X Datasheet, PDF (5/62 Pages) Texas Instruments – Advanced LinCMOSE LOW-NOISE PRECISION OPERATIONAL AMPLIFIERS

TLC220x, TLC220xA, TLC220xB, TLC220xY
Advanced LinCMOS™ LOW-NOISE PRECISION
OPERATIONAL AMPLIFIERS
SLOS175 – FEBRUARY 1997
TLC2201Y chip information
This chip, when properly assembled, displays characteristics similar to the TLC2201C. Thermal compression
or ultrasonic bonding may be used on the doped-aluminum bonding path. Chips may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(8)
(7)
(6)
(2)
IN –
(3)
IN +
VDD+
(7)
+
–
(4)
VDD _–
(6)
OUT
77
(1)
(2)
65
(3)
(4)
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
TJmax = 150°C
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO BACK SIDE OF CHIP.
TERMINAL NUMBERS ARE FOR THE
D, JG, AND P PACKAGES.
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