TL081 Datasheet, PDF (6/29 Pages) STMicroelectronics – GENERAL PURPOSE J-FET SINGLE OPERATIONAL AMPLIFIER

TL081, TL081A, TL081B, TL082, TL082A, TL082B
TL082Y, TL084, TL084A, TL084B, TL084Y
JFET-INPUT OPERATIONAL AMPLIFIERS
SLOS081E – FEBRUARY 1977 – REVISED FEBRUARY 1999
TL084Y chip information
These chips, when properly assembled, display characteristics similar to the TL084. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(13)
(12)
(11)
(10)
(14)
62
(1)
(2)
(3)
(4)
105
VCC+
(4)
1IN + ⁽³⁾ ₊
(1)
(2)
1OUT
(9)
1IN –
–
(7)
+ ⁽⁵⁾ _{2IN +}
2OUT
3IN +
(10)
+
(6)
–
2IN –
(8)
(8)
(9)
3IN –
–
3OUT
(7)
(14)
4OUT
+ ⁽¹²⁾ _{4IN +}
(13)
–
4IN –
(11)
VCC _–
(6)
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
TJmax = 150°C
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN MILS.
PIN (11) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
6
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