TL081 Datasheet, PDF (5/29 Pages) STMicroelectronics – GENERAL PURPOSE J-FET SINGLE OPERATIONAL AMPLIFIER

TL081, TL081A, TL081B, TL082, TL082A, TL082B
TL082Y, TL084, TL084A, TL084B, TL084Y
JFET-INPUT OPERATIONAL AMPLIFIERS
SLOS081E – FEBRUARY 1977 – REVISED FEBRUARY 1999
TL082Y chip information
These chips, when properly assembled, display characteristics similar to the TL082. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(7)
61
(8)
(1)
(6) (5)
(4)
(2) (3)
61
1IN + ⁽³⁾
(2)
1IN –
(7)
2OUT
VCC+
(8)
+
–
+
–
(4)
VCC _–
(1)
1OUT
(5)
2IN +
(6)
2IN –
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
TJmax = 150°C
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
• POST OFFICE BOX 655303 DALLAS, TEXAS 75265
5