TL081 Datasheet, PDF (3/29 Pages) STMicroelectronics – GENERAL PURPOSE J-FET SINGLE OPERATIONAL AMPLIFIER

AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax _SMALL
SMALL
CHIP CERAMIC CERAMIC PLASTIC
AT 25°C _{OUTLINE OUTLINE CARRIER}
DIP
DIP
DIP
(D008)
(D014)
(FK)
(J)
(JG)
(N)
15 mV TL081CD
6 mV TL081ACD
—
—
—
—
—
3 mV TL081BCD
0°C
15 mV TL082CD
to
6 mV TL082ACD
—
—
—
—
—
70°C
3 mV TL082BCD
15 mV
TL084CD
TL084CN
6 mV
—
TL084ACD
—
—
—
TL084ACN
3 mV
TL084BCD
TL084BCN
– 40°C
6 mV TL081ID
to
6 mV TL082ID
—
—
—
85°C
6 mV TL084ID TL084ID
TL084IN
– 40°C
to
—
—
—
—
—
125°C
9 mV
TL084QD
– 55°C
6 mV
to
6 mV
—
125°C
9 mV
TL081MFK
TL081MJG
—
TL082MFK
TL082MJG
—
TL084MFK TL084MJ
The D package is available taped and reeled. Add R suffix to the device type (e.g., TL081CDR).
PLASTIC
DIP
(P)
TL081CP
TL081ACP
TL081BCP
TL082CP
TL082ACP
TL082BCP
—
TL081IP
TL082IP
—
—
TSSOP
(PW)
TL081CPW
FLAT
PACK
(U)
—
TL082CPW
—
TL084CPW
—
FLAT
PACK
(W)
CHIP
FORM
(Y)
—
—
TL082Y
—
TL084Y
—
—
—
—
—
—
—
—
—
TL081MU
—
TL082MU
—
TL084MW