THS8083A Datasheet, PDF (55/64 Pages) Texas Instruments – TRIPLE 8 BIT 80 MSPS 3.3V VIDEO AND GRAPHICS

7 Mechanical Data
PZP (S-PQFP-G100)
0,50
75
76
PowerPAD PLASTIC QUAD FLATPACK
0,27
0,17
51
0,08 M
50
Thermal Pad
(see Note D)
100
26
0,13 NOM
1
1,05
0,95
25
12,00 TYP
14,20
13,80 ^SQ
16,20
15,80 ^SQ
0,25
0,15
0,05
0,75
0,45
Seating Plane
Gage Plane
0°–ā7°
1,20 MAX
0,08
4146929/A 04/99
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane.
This pad is electrically and thermally connected to the backside of the die and possibly selected leads.
E. Falls within JEDEC MS-026
PowerPAD is a trademark of Texas Instruments.
7–1