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BQ24150A Datasheet, PDF (5/41 Pages) Texas Instruments – Fully Integrated Switch-Mode One-Cell Li-Ion Charger With Full USB Compliance and USB-OTG Support
bq24150A
bq24151A
www.ti.com ..................................................................................................................................................................................................... SLUS931 – APRIL 2009
ELECTRICAL CHARACTERISTICS (continued)
Circuit of Figure 1, VBUS = 5 V, HZ_MODE = 0, OPA_MODE = 0 (charger mode operation), TJ = 0°C to 125°C, TJ = 25°C for
typical values (unless otherwise noted)
PARAMETER
TEST CONDITIONS
INPUT CURRENT LIMITING
IIN
Input current limiting threshold
VREF BIAS REGULATOR
USB charge
mode
IIN = 100 mA
IIN = 500 mA
VREF
Internal bias regulator voltage
VREF output short current limit
BATTERY RECHARGE THRESHOLD
VBUS >VIN(min) or V(AUXPWR) > V(BAT)min,
I(VREF) = 1 mA, C(VREF) = 1 µF
V(RCH)
Recharge threshold voltage
Deglitch time
STAT OUTPUTS
Below V(OREG)
V(AUXPWR) decreasing below threshold,
tFALL = 100 ns, 10-mV overdrive
VOL(STAT)
Low-level output saturation voltage, STAT
High-level leakage current for STAT
IO = 10 mA, sink current
Voltage on STAT pin is 5 V
I2C BUS LOGIC LEVELS AND TIMING CHARACTERISTICS
VOL
Output low threshold level
VIL
Input low threshold level
VIH
Input high threshold level
I(BIAS)
Input bias current
f(SCL)
SCL clock frequency
BATTERY DETECTION
IO = 10 mA, sink current
V(pull-up) = 1.8 V, SDA and SCL
I(DETECT)
Battery detection current before charge done
(sink current) (1)
Battery detection time
Begins after termination detected,
V(AUXPWR) ≤ V(OREG)
SLEEP COMPARATOR
V(SLP)
Sleep-mode entry threshold,
VBUS - VAUXPWR
Sleep-mode exit hysteresis
V(SLP_EXIT)
Deglitch time for VBUS rising above V(SLP) +
V(SLP_EXIT)
UNDERVOLTAGE LOCKOUT
2.3 V ≤ V(AUXPWR) ≤ V(OREG), VBUS falling
2.3 V ≤ V(AUXPWR) ≤ V(OREG)
Rising voltage, 2-mV overdrive, tRISE = 100 ns
UVLO
IC active threshold voltage
VBUS rising
UVLO(HYS)
PWM
IC active hysteresis
VBUS falling from above UVLO
Voltage from BOOT pin to SW pin
During charge or boost operation
Internal top reverse blocking MOSFET
on-resistance
IIN(LIMIT) = 500 mA, Measured from VBUS to PMID
Internal top N-channel Switching MOSFET
on-resistance
Measured from PMID to SW, VBOOT - VSW= 4V
Internal bottom N-channel MOSFET
on-resistance
Measured from SW to PGND
f(OSC)
Oscillator frequency
Frequency accuracy
D(MAX)
D(MIN)
Maximum duty cycle
Minimum duty cycle
Synchronous mode to non-synchronous mode
transition current threshold(2)
Low side MOSFET cycle by cycle current sensing
MIN TYP MAX UNIT
88
93
98 mA
450
475
500
2
6.5
V
30
mA
100
120
150 mV
130
ms
0.4
V
1 µA
0.4
V
0.4
V
1.2
V
1 µA
3.4 MHz
–0.45
mA
262
ms
0
40
100 mV
40
100
160 mV
30
ms
3.05
3.3 3.55
V
120
150
mV
6.5
V
180
250
120
250 mΩ
110
–10%
0
3
99.5%
100
200
10%
MHz
mA
(1) Negative charge current means the charge current flows from the battery to charger (discharging battery).
(2) Bottom N-channel MOSFET always turns on for ≈60 ns and then turns off if current is too low.
Copyright © 2009, Texas Instruments Incorporated
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