TLE2141-EP Datasheet, PDF (4/22 Pages) Texas Instruments – Excalibur™ LOW-NOISE HIGH-SPEED PRECISION OPERATIONAL AMPLIFIER

ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
Maximum Pin Voltage (Except as below)
All other pins -0.3V to Vcc + 0.3V
Maximum Current (into any pin)
V_CC
6.0
V
±100
mA
THERMAL RATINGS
Ambient Temperature Range
Operating Junction Temperature
Maximum Junction Temperature
Storage Temperature Range
T_A
-40 to 85
°C
T_J
-40 to 125
°C
T_JMAX
150
°C
T_STORE
-40 to 150
°C
Power Dissipation (UDFN package with EP soldered to ground plane)
T_A = 25°C
T_A = 70°C
W
1790
1140
Thermal Resistance (6-LD UDFN)
Peak Package Soldering Temperature During Reflow⁽²⁾,⁽³⁾
°C/W
θ_JA
70
θ_JC
10
T_PPRT
260
°C
Notes
1. ESD testing is performed in accordance with the Human Body Model (HBM) (C_ZAP = 100pF, R_ZAP = 1500Ω), the Machine Model (MM)
(C_ZAP = 200pF, R_ZAP = 0Ω), and the Charge Device Model (CDM), Robotic (C_ZAP = 4.0pF).
2. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
3. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
34830
4
Analog Integrated Circuit Device Data
Freescale Semiconductor