TLE2141-EP Datasheet, PDF (17/22 Pages) Texas Instruments – Excalibur™ LOW-NOISE HIGH-SPEED PRECISION OPERATIONAL AMPLIFIER

TYPICAL APPLICATIONS
Table 5. 34830 Bill of Material
Item
Qty
Part Description
Value / Rating
Part Number / Manufacturer
Install
EN
1
E-Switch
Switch SPDT
SPDT, EG1218
Y
VCC
2POL254 Phoenix Termblock2_MKD ^{MKDSN1.5/2, 2 pin Terminal block 2 Diga- Y}
1
Connector
key, 5.0mm, 90 deg wire to pin, Stock
number - 277-1236-ND
Freescale does not assume liability, endorse, or warrant components from external manufacturers that are referenced in circuit drawings or
tables. While Freescale offers component recommendations in this configuration, it is the customer’s responsibility to validate their application.
PCB LAYOUT CONSIDERATIONS
The 34830 is a high-speed amplifier, and as such requires
careful attention to be paid to the way in which boards are laid
out, in order to guarantee best performance. All high-speed
layout techniques should be followed including the following
points.
1. Minimize all trace inductances by reducing trace
lengths. This is especially critical for the supply and
ground lines as well as for the output line. Boards with
multiple layers should have enough vias from the
ground plane to the chip ground connection to further
reduce inductance.
2. Make sure that a solid ground plane is available and
run all traces above it.
3. Avoid traces with 90 degree bends.
4. Use a 0.1μF bypass capacitor in series with a 4.7Ω
resistor as close to the V_CC and GND pins of the 34830
as possible. Include a 10μF bypass capacitor at the
location on the board where V_CC and GND are
connected to the external world.
5. Try to refer all ground connections to the same point as
in a star ground configuration. Usually this point is the
middle point of the ground plane.
THERMAL CONSIDERATIONS
Make sure that the thermal dissipation ratings for the
34830 package are not violated in the application at hand.
The 34830 comes in a package with an exposed pad (EP).
The primary function of the EP is to serve as an effective way
to dissipate heat away from the inside of the package. Take
full advantage of this feature and connect the EP to a surface
or plane that can act as a heat sink. The EP is electrically
connected to ground. Make sure that the heat sink is also
connected to the same potential. If multiple heat generating
components are used in the application, distribute these
evenly throughout the board, so as not to create hot spots
with large temperature gradients that could violate power and
heat dissipation ratings.
POWER DISSIPATION
Care must be taken not to exceed the maximum die
junction temperature of the 34830. The die junction
temperature can be calculated through the formula:
TJ = T_A + P_DISS × θ_JA
Where P_DISS is the average power dissipation of the
device which can be calculated as P_DISS = V_CC*(I_CC +
V_OUT(RMS)2/R_LOAD).
Analog Integrated Circuit Device Data
Freescale Semiconductor
34830
17