TLE202XA Datasheet, PDF (4/79 Pages) Texas Instruments – EXCALIBUR HIGH-SPEED LOW-POWER PRECISION OPERATIONAL AMPLIFIERS

TLE202x, TLE202xA, TLE202xB, TLE202xY
EXCALIBUR HIGH-SPEED LOW-POWER PRECISION
OPERATIONAL AMPLIFIERS
SLOS191B – FEBRUARY 1997 – REVISED JANUARY 2002
DW PACKAGE
(TOP VIEW)
FK PACKAGE
(TOP VIEW)
J OR N PACKAGE
(TOP VIEW)
1OUT 1
1IN – 2
1IN + 3
V_{CC +} 4
2IN + 5
2IN – 6
2OUT 7
NC 8
16 4OUT
15 4IN–
14 4IN +
13 V_{CC –} /GND
12 3IN +
11 3IN –
10 3OUT
9 NC
1IN +
NC
V_{CC +}
NC
2IN +
3 2 1 20 19
4
18
5
17
6
16
7
15
8
14
9 10 11 12 13
4IN +
NC
V_{CC –} /GND
NC
3IN +
1OUT ₁
1IN – ₂
1IN + ₃
V_{CC + 4}
2IN + ₅
2IN – ₆
2OUT ₇
14 4OUT
13 4IN –
12 ^{4IN +}
11 ^V_{CC –} ^/GND
10 ^{3IN +}
9 ^{3IN –}
8 ^3OUT
NC – No internal connection
TLE2021Y chip information
This chip, when properly assembled, display characteristics similar to the TLE2021. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. This chip may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(7)
(6)
78
(1)
(2)
54
(5)
(1)
OFFSET N1
VCC+
(7)
IN + ⁽³⁾ ₊
(2)
IN –
–
(6)
OUT
OFFSET N2
(5)
(4)
VCC _– /GND
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
TJmax= 150°C
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN MILS.
(4)
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
(3)
4
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