DRV8813_15 Datasheet, PDF (4/27 Pages) Texas Instruments – DRV8813 Dual-Bridge Motor Controller IC

DRV8813
SLVSA72E – APRIL 2010 – REVISED OCTOBER 2015
www.ti.com
NAME
PIN
NO.
BVREF
13
DECAY
19
nRESET
16
nSLEEP
17
STATUS
nFAULT
18
OUTPUT
AOUT1
5
AOUT2
7
BOUT1
10
BOUT2
8
ISENA
6
ISENB
9
I/O ⁽¹⁾
I
I
I
I
Pin Functions (continued)
DESCRIPTION
EXTERNAL COMPONENTS OR CONNECTIONS
Bridge B current set reference input
Decay mode
Reset input
Sleep mode input
Reference voltage for winding current set. Can be
driven individually with an external DAC for
microstepping, or tied to a reference (for example,
V3P3OUT).
Low = slow decay, open = mixed decay,
high = fast decay. Internal pulldown and pullup.
Active-low reset input initializes internal logic and
disables the H-bridge outputs. Internal pulldown.
Logic high to enable device, logic low to enter low-
power sleep mode. Internal pulldown.
OD
Fault
Logic low when in fault condition (overtemperature,
overcurrent)
O
Bridge A output 1
O
Bridge A output 2
O
Bridge B output 1
O
Bridge B output 2
IO
Bridge A ground / Isense
IO
Bridge B ground / Isense
Connect to motor winding A
Connect to motor winding B
Connect to current sense resistor for bridge A
Connect to current sense resistor for bridge B
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) ^{(1) (2)}
MIN
MAX
UNIT
VMx
Power supply voltage
Power supply ramp rate
–0.3
50
V
1
V/µs
Digital pin voltage
–0.5
7
V
VREF
Input voltage
ISENSEx pin voltage⁽³⁾
–0.3
4
V
–0.8
0.8
V
Peak motor drive output current, t < 1 μS
Continuous motor drive output current⁽⁴⁾
Internally limited
A
0
2.5
A
Continuous total power dissipation
See Thermal Information
T_J
Operating virtual junction temperature
T_A
Operating ambient temperature
T_stg
Storage temperature
–40
150
°C
–40
85
°C
–60
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
(3) Transients of ±1V for less than 25 ns are acceptable
(4) Power dissipation and thermal limits must be observed.
6.2 ESD Ratings
V_(ESD)
Electrostatic
discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins⁽¹⁾
Charged device model (CDM), per JEDEC specification JESD22-C101, all
pins ⁽²⁾
VALUE
±2000
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
4
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