DRV8813_15 Datasheet, PDF (17/27 Pages) Texas Instruments – DRV8813 Dual-Bridge Motor Controller IC

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10 Layout
DRV8813
SLVSA72E – APRIL 2010 – REVISED OCTOBER 2015
10.1 Layout Guidelines
• The VMA and VMB pins should be bypassed to GND using low-ESR ceramic bypass capacitors with a
recommended value of 0.1-μF rated for VMx. This capacitor should be placed as close to the VMA and VMB
pins as possible with a thick trace or ground plane connection to the device GND pin.
• The VMA and VMB pins must be bypassed to ground using an appropriate bulk capacitor. This component
may be an electrolytic and should be located close to the DRV8813.
• A low-ESR ceramic capacitor must be placed in between the CPL and CPH pins. TI recommends a value of
0.01-μF rated for VMx. Place this component as close to the pins as possible.
• A low-ESR ceramic capacitor must be placed in between the VMA and VCP pins. TI recommends a value of
0.1-μF rated for 16 V. Place this component as close to the pins as possible. Also, place a 1-MΩ resistor
between VCP and VMA.
• Bypass V3P3 to ground with a ceramic capacitor rated 6.3 V. Place this bypass capacitor as close to the pin
as possible.
10.2 Layout Example
0.1 µF
0.01 µF
1 0Ÿ
0.1 µF
R_ISENA
R_ISENB
0.1 µF
CP1
CP2
VCP
VMA
AOUT1
ISENA
AOUT2
BOUT2
ISENB
BOUT1
VMB
AVREF
BVREF
GND
GND
BI1
BI0
AI1
AI0
BPHASE
BENBL
AENBL
APHASE
DECAY
nFAULT
nSLEEP
nRESET
V3P3OUT
0.47 µF
Figure 11. DRV8813 Layout Example
10.3 Thermal Considerations
10.3.1 Thermal Protection
The DRV8813 has thermal shutdown (TSD) as described in Thermal Shutdown (TSD). If the die temperature
exceeds approximately 150°C, the device is disabled until the temperature drops to a safe level.
Any tendency of the device to enter TSD is an indication of either excessive power dissipation, insufficient
heatsinking, or too high an ambient temperature.
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