AMC1203_15 Datasheet, PDF (4/29 Pages) Texas Instruments – 1-Bit, 10MHz, 2nd-Order, Isolated Delta-Sigma Modulator

AMC1203
SBAS427C – FEBRUARY 2008 – REVISED JUNE 2011
www.ti.com
PACKAGE CHARACTERISTICS⁽¹⁾
Over recommended operating conditions, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
DUB
7
mm
L(I01) Minimum air gap (clearance)
Shortest terminal to terminal distance
through air
DW
8
mm
PSA
6.3
mm
DUB
7
mm
L(I02)
Minimum external tracking
(creepage)
Shortest terminal to terminal distance
across the package surface
DW
8
mm
PSA
6.3
mm
CTI
Tracking resistance (comparative
tracking index)
DIN IEC 60112 / VDE 0303 Part 1
≥ 175
V
Minimum internal gap (internal
clearance)
Distance through the insulation
0.008
mm
R_IO Isolation resistance
Input to output, V_IO = 500V, all pins on each side
of the barrier tied together creating a two-terminal
> 10¹²
Ω
device, T_A < +85°C
Input to output, V_IO = 500V,
+100°C ≤ T_A < T_A max
> 10¹¹
Ω
C_IO Barrier capacitance input to output V_I = 0.8V_PP at 1MHz
1.2
pF
C_I
Input capacitance to ground
V_I = 0.8V_PP at 1MHz
3
pF
(1) Creepage and clearance requirements should be applied according to the specific equipment isolation standards of an application. Care
should be taken to maintain the creepage and clearance distance of the board design to ensure that the mounting pads of the isolator
on the printed circuit board do not reduce this distance. Creepage and clearance on a printed circuit board become equal according to
the measurement techniques shown in the Isolation Glossary
. Techniques such as inserting grooves and/or ribs on a printed
circuit board are used to help increase these specifications.
IEC SAFETY LIMITING VALUES
Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output (I/O) circuitry. A
failure of the I/O circuitry can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient
power to overheat the die and damage the isolation barrier, potentially leading to secondary system failures.
The safety-limiting constraint is the operating virtual junction temperature range specified in the Absolute Maximum Ratings
table. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware
determines the junction temperature. The assumed junction-to-air thermal resistance in the Thermal Characteristics table is
that of a device installed in the JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount
Packages and is conservative. The power is the recommended maximum input voltage times the current. The junction
temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance.
PARAMETER
TEST CONDITIONS
MIN TYP
MAX UNIT
I_S Safety input, output, or supply current
T_C Maximum case temperature
θ_JA = 246°C/W, V_I = 5.5V, T_J = +150°C, T_A = +25°C
90 mA
+150 °C
IEC 61000-4-5 RATINGS
PARAMETER
V_IOSM Surge immunity
TEST CONDITIONS
1.2/50μs voltage surge and 8/20μs current surge
VALUE
±6000
UNIT
V
IEC 60664-1 RATINGS
PARAMETER
Basic isolation group
Installation classification
TEST CONDITIONS
Material group
Rated mains voltage ≤ 150 V_RMS
Rated mains voltage < 300 V_RMS
SPECIFICATION
IIIa
I-IV
I-III
4
Copyright © 2008–2011, Texas Instruments Incorporated