ADS62P49 Datasheet, PDF (4/76 Pages) Texas Instruments – Dual Channel 14-/12-Bit, 250-/210-MSPS ADC With DDR LVDS and Parallel CMOS Outputs

ADS62P49 / ADS62P29
ADS62P48 / ADS62P28
SLAS635A – APRIL 2009 – REVISED JUNE 2009............................................................................................................................................................. www.ti.com
PRODUCT
ADS62P49
ADS62P48
ADS62P29
ADS62P28
PACKAGE/ORDERING INFORMATION⁽¹⁾
PACKAGE- PACKAGE
LEAD DESIGNATOR
QFN-64
RGC
SPECIFIED
TEMPERATURE
RANGE
–40°C to 85°C
ECO
PLAN ⁽²⁾
GREEN
(RoHS and
no Sb/Br)
LEAD/BALL
FINISH
Cu NiPdAu
PACKAGE
MARKING
AZ62P49
AZ62P48
AZ62P29
AZ62P28
ORDERING
NUMBER
ADS62P49IRGCT,
ADS62P49IRGCR
ADS62P48IRGCT,
ADS62P48IRGCR
ADS62P29IRGCT,
ADS62P29IRGCR
ADS62P28IRGCT,
ADS62P28IRGCR
TRANSPORT
MEDIA,QUANTITY
Tape and Reel
Tape and Reel
(1) For the most current product and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com. or
(2) Eco Plan – The planned eco-friendly classification: Green (RoHS and no Sb/Br): TI defines “Green” to mean Pb-Free (RoHS compatible)
and free of Bromine (Br) and Antimony (Sb) based flame retardants.
ABSOLUTE MAXIMUM RATINGS⁽¹⁾
over operating free-air temperature range (unless otherwise noted)
Supply voltage range, AVDD
Supply voltage range, DRVDD
Voltage between AGND and DRGND
Voltage between AVDD to DRVDD (when AVDD leads DRVDD)
Voltage between DRVDD to AVDD (when DRVDD leads AVDD)
Voltage applied to external pin, VCM (in external reference mode)
Voltage applied to analog input pins – INP_A, INM_A, INP_B, INM_B
Voltage applied to input pins - CLKP, CLKM⁽²⁾, RESET, SCLK, SDATA,
SEN, CTRL1, CTRL2, CTRL3
T_A Operating free-air temperature range
T_J Operating junction temperature range
T_stg Storage temperature range
ESD, human body model
VALUE
–0.3 V to 3.9
–0.3 V to 2.2
–0.3 to 0.3
0 to 3.3
–1.5 to 1.8
–0.3 to 2.0
–0.3V to minimum ( 3.6, AVDD + 0.3V )
–0.3V to AVDD + 0.3V
–40 to 85
125
–65 to 150
2
UNIT
V
V
V
V
V
V
V
V
°C
°C
°C
kV
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
(2) When AVDD is turned off, it is recommended to switch off the input clock (or ensure the voltage on CLKP, CLKM is < |0.3V|. This
prevents the ESD protection diodes at the clock input pins from turning on.
THERMAL CHARACTERISTICS⁽¹⁾
over operating free-air temperature range (unless otherwise noted)
PARAMETER
R_θJA ⁽²⁾
R_θJT ⁽³⁾
TEST CONDITIONS
Soldered thermal pad, no airflow
Soldered thermal pad, 200 LFM
Bottom of package (thermal pad)
MIN TYP
22
15
0.57
(1) With a JEDEC standard high-K board and 5x5 via array. See Exposed Pad in the Application Information.
(2) R_θJA is the thermal resistance from the junction to ambient.
(3) R_θJT is the thermal resistance from the junction to the thermal pad.
MAX
UNIT
°C/W
°C/W
°C/W
4
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