CC2650_15 Datasheet, PDF (37/52 Pages) Texas Instruments – CC2650 SimpleLink Multistandard Wireless MCU

www.ti.com
CC2650
SWRS158 – FEBRUARY 2015
8.3.3 Texas Instruments Low-Power RF Developer Network
Texas Instruments has launched an extensive network of low-power RF development partners to help
customers speed up their application development. The network consists of recommended companies, RF
consultants, and independent design houses that provide a series of hardware module products and
design services, including:
• RF circuit, low-power RF, and ZigBee design services
• Low-power RF and ZigBee module solutions and development tools
• RF certification services and RF circuit manufacturing
For help with modules, engineering services or development tools:
Search the Low-Power RF Developer Network to find a suitable partner. www.ti.com/lprfnetwork
8.3.4 Low-Power RF eNewsletter
The Low-Power RF eNewsletter is up-to-date on new products, news releases, developers’ news, and
other news and events associated with low-power RF products from TI. The Low-Power RF eNewsletter
articles include links to get more online information.
Sign up at: www.ti.com/lprfnewsletter
8.4 Trademarks
IAR Embedded Workbench is a registered trademark of IAR Systems AB.
SimpleLink, SmartRF, Code Composer Studio, CC26xx, E2E are trademarks of Texas Instruments.
ARM7 is a trademark of ARM Limited.
ARM, Cortex are registered trademarks of ARM Limited (or its subsidiaries).
ARM Thumb is a registered trademark of ARM Limited.
Bluetooth is a registered trademark of Bluetooth SIG, Inc.
CoreMark is a registered trademark of Embedded Microprocessor Benchmark Consortium.
IEEE Std 1241 is a trademark of Institute of Electrical and Electronics Engineers, Incorporated.
ZigBee is a registered trademark of ZigBee Alliance, Inc. .
8.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
8.6 Export Control Notice
Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data
(as defined by the U.S., EU, and other Export Administration Regulations) including software, or any
controlled product restricted by other applicable national regulations, received from Disclosing party under
this Agreement, or any direct product of such technology, to any destination to which such export or re-
export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from
U.S. Department of Commerce and other competent Government authorities to the extent required by
those laws.
8.7 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms and definitions.
Copyright © 2015, Texas Instruments Incorporated
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