THS6002 Datasheet, PDF (32/40 Pages) Texas Instruments – DUAL DIFFERENTIAL LINE DRIVERS AND RECEIVERS

THS6002
DUAL DIFFERENTIAL LINE DRIVERS AND RECEIVERS
SLOS202D– JANUARY 1998– REVISED JULY 1999
APPLICATION INFORMATION
PCB design considerations (continued)
Additional 4 vias outside of thermal pad area
but under the package
(Via diameter = 25 mils)
Thermal pad area (0.15 x 0.17) with 5 vias
(Via diameter = 13 mils)
Figure 57. PowerPad PCB Etch and Via Pattern
The actual thermal performance achieved with the THS6002 in its PowerPAD package depends on the
application. In the previous example, if the size of the internal ground plane is approximately 3 inches × 3 inches,
+ ǒ Ǔ ^{then the expected thermal coefficient, θJA, is about 21.5_C/W. For a given θJA, the maximum power dissipation}
is shown in Figure 58 and is calculated by the following formula:
PD
TMAX–TA
q_JA
Where:
P_D = Maximum power dissipation of THS6002 (watts)
T_MAX = Absolute maximum junction temperature (150°C)
T_A = Free-ambient air temperature (°C)
θ_JA = θ_JC + θ_CA
θ_JC = Thermal coefficient from junction to case (0.37°C/W)
θ_CA = Thermal coefficient from case to ambient
More complete details of the PowerPAD installation process and thermal management techniques can be found
in the Texas Instruments Technical Brief, PowerPAD Thermally Enhanced Package. This document can be
found at the TI web site (www.ti.com) by searching on the key word PowerPAD. The document can also be
ordered through your local TI sales office. Refer to literature number SLMA002 when ordering.
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