THS6002 Datasheet, PDF (24/40 Pages) Texas Instruments – DUAL DIFFERENTIAL LINE DRIVERS AND RECEIVERS

THS6002
DUAL DIFFERENTIAL LINE DRIVERS AND RECEIVERS
SLOS202D– JANUARY 1998– REVISED JULY 1999
TYPICAL CHARACTERISTICS
RECEIVER OUTPUT
20 V STEP RESPONSE
16
VCC = ±15 V
12
Gain = 5
RL = 150 Ω
RF = 2 kΩ
8
tr/tf= 5 ns
See Figure 4
4
0
–4
–8
–12
–16
0
50 100 150 200 250 300 350 400 450 500
t – Time – ns
Figure 51
APPLICATION INFORMATION
The THS6002 contains four independent operational amplifiers. Two are designated as drivers because of their
high output current capability, and two are designated as receivers. The receiver amplifiers are current feedback
topology amplifiers made for high-speed operation and are capable of driving output loads of at least 80 mA.
The drivers are also current feedback topology amplifiers. However, the drivers have been specifically designed
to deliver the full power requirements of ADSL and therefore can deliver output currents of at least 400 mA at
full output voltage.
The THS6002 is fabricated using Texas Instruments 30-V complementary bipolar process, HVBiCOM. This
process provides excellent isolation and high slew rates that result in the device’s excellent crosstalk and
extremely low distortion.
independent power supplies
Each amplifier of the THS6002 has its own power supply pins. This was specifically done to solve a problem
that often occurs when multiple devices in the same package share common power pins. This problem is
crosstalk between the individual devices caused by currents flowing in common connections. Whenever the
current required by one device flows through a common connection shared with another device, this current,
in conjunction with the impedance in the shared line, produces an unwanted voltage on the power supply. Proper
power supply decoupling and good device power supply rejection helps to reduce this unwanted signal. What
is left is crosstalk.
However, with independent power supply pins for each device, the effects of crosstalk through common
impedance in the power supplies is more easily managed. This is because it is much easier to achieve low
common impedance on the PCB with copper etch than it is to achieve low impedance within the package with
either bond wires or metal traces on silicon.
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