TIBPAL20L8-5C Datasheet, PDF (31/35 Pages) Texas Instruments – HIGH-PERFORMANCE IMPACT-X PAL CIRCUITS

W (R-GDFP-F24)
Base and Seating Plane
0.375 (9,53)
0.340 (8,64)
MECHANICAL DATA
MCFP007 – OCTOBER 1994
CERAMIC DUAL FLATPACK
0.090 (2,29)
0.045 (1,14)
0.360 (9,14)
0.240 (6,10)
0.395 (10,03)
0.360 (9,14)
1
24
0.006 (0,15)
0.004 (0,10)
0.360 (9,14)
0.240 (6,10)
0.045 (1,14)
0.026 (0,66)
0.019 (0,48)
0.015 (0,38)
0.640 (16,26)
0.490 (12,45)
12 _{30° TYP}
13
1.115 (28,32)
0.840 (21,34)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Falls within MIL-STD-1835 GDFP2-F24 and JEDEC MO-070AD
E. Index point is provided on cap for terminal identification only.
0.050 (1,27)
0.030 (0,76)
0.015 (0,38)
4040180-5 / B 03/95
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