TMS320C28346 Datasheet, PDF (3/153 Pages) Texas Instruments – Delfino Microcontrollers

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TMS320C28346, TMS320C28345, TMS320C28344
TMS320C28343, TMS320C28342, TMS320C28341
Delfino Microcontrollers
SPRS516 – MARCH 2009
4.8 Enhanced Controller Area Network (eCAN) Modules (eCAN-A and eCAN-B)..................................... 73
4.9 Serial Communications Interface (SCI) Modules (SCI-A, SCI-B, SCI-C) ........................................... 78
4.10 Serial Peripheral Interface (SPI) Module (SPI-A, SPI-D) ............................................................. 81
4.11 Inter-Integrated Circuit (I2C) .............................................................................................. 84
4.12 GPIO MUX .................................................................................................................. 85
4.13 External Interface (XINTF) ................................................................................................ 92
5 Device Support .................................................................................................................. 94
5.1 Device and Development Support Tool Nomenclature................................................................ 94
5.2 Documentation Support ................................................................................................... 96
6 Electrical Specifications .................................................................................................... 100
6.1 Absolute Maximum Ratings ............................................................................................. 100
6.2 Recommended Operating Conditions.................................................................................. 101
6.3 Electrical Characteristics ................................................................................................ 101
6.4 Current Consumption..................................................................................................... 102
6.4.1 Reducing Current Consumption ............................................................................. 103
6.5 Thermal Design Considerations ........................................................................................ 105
6.6 Emulator Connection Without Signal Buffering for the MCU........................................................ 105
6.7 Timing Parameter Symbology........................................................................................... 106
6.7.1 General Notes on Timing Parameters....................................................................... 106
6.7.2 Test Load Circuit .............................................................................................. 106
6.7.3 Device Clock Table ........................................................................................... 107
6.8 Clock Requirements and Characteristics ............................................................................. 108
6.9 Power Sequencing........................................................................................................ 109
6.9.1 Power Management and Supervisory Circuit Solutions................................................... 109
6.10 General-Purpose Input/Output (GPIO)................................................................................. 112
6.10.1 GPIO - Output Timing ......................................................................................... 112
6.10.2 GPIO - Input Timing ........................................................................................... 113
6.10.3 Sampling Window Width for Input Signals.................................................................. 114
6.10.4 Low-Power Mode Wakeup Timing........................................................................... 115
6.11 Enhanced Control Peripherals .......................................................................................... 118
6.11.1 Enhanced Pulse Width Modulator (ePWM) Timing........................................................ 118
6.11.2 Trip-Zone Input Timing ........................................................................................ 118
6.12 External Interrupt Timing................................................................................................. 120
6.13 I2C Electrical Specification and Timing ................................................................................ 121
6.14 Serial Peripheral Interface (SPI) Timing ............................................................................... 121
6.14.1 Master Mode Timing........................................................................................... 121
6.14.2 SPI Slave Mode Timing ....................................................................................... 125
6.15 External Interface (XINTF) Timing...................................................................................... 127
6.15.1 USEREADY = 0 ................................................................................................ 128
6.15.2 Synchronous Mode (USEREADY = 1, READYMODE = 0) .............................................. 128
6.15.3 Asynchronous Mode (USEREADY = 1, READYMODE = 1) ............................................. 129
6.15.4 XINTF Signal Alignment to XCLKOUT ...................................................................... 130
6.15.5 External Interface Read Timing .............................................................................. 131
6.15.6 External Interface Write Timing .............................................................................. 132
6.15.7 External Interface Ready-on-Read Timing With One External Wait State ............................. 134
6.15.8 External Interface Ready-on-Write Timing With One External Wait State.............................. 137
6.15.9 XHOLD and XHOLDA Timing ................................................................................ 140
6.16 Multichannel Buffered Serial Port (McBSP) Timing .................................................................. 142
6.16.1 McBSP Transmit and Receive Timing ...................................................................... 142
6.16.2 McBSP as SPI Master or Slave Timing ..................................................................... 145
7 Thermal/Mechanical Data................................................................................................... 149
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