THS4011 Datasheet, PDF (27/30 Pages) Texas Instruments – 290-MHz LOW-DISTORTION HIGH-SPEED AMPLIFIERS

DGN (S-PDSO-G8)
0,65
8
THS4011, THS4012
290-MHz LOW-DISTORTION HIGH-SPEED AMPLIFIERS
SLOS216B – JUNE 1999 – FEBRUARY 2000
MECHANICAL INFORMATION
PowerPAD™ PLASTIC SMALL-OUTLINE PACKAGE
0,38
0,25
5
0,25 M
3,05 4,98
2,95 4,78
Thermal Pad
(See Note D)
0,15 NOM
1
4
3,05
2,95
Gage Plane
0°– 6°
0,25
0,69
0,41
1,07 MAX
0,15
0,05
Seating Plane
0,10
4073271/A 04/98
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions include mold flash or protrusions.
D. The package thermal performance may be enhanced by attaching an external heat sink to the thermal pad.
This pad is electrically and thermally connected to the backside of the die and possibly selected leads.
E. Falls within JEDEC MO-187
PowerPAD is a trademark of Texas Instruments Incorporated.
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