THS6007 Datasheet, PDF (24/36 Pages) Texas Instruments – DUAL DIFFERENTIAL LINE DRIVERS AND LOW-POWER RECEIVERS

THS6007
DUAL DIFFERENTIAL LINE DRIVERS AND LOW-POWER RECEIVERS
SLOS334– DECEMBER 2000
APPLICATION INFORMATION
device protection features
The drivers of the THS6007 have two built-in protection features that protect the device against improper
operation. The first protection mechanism is output current limiting. Should the drivers output become shorted
to ground, the output current is automatically limited to the value given in the data sheet. While this protects the
output against excessive current, the device internal power dissipation increases due to the high current and
large voltage drop across the output transistors. Continuous output shorts are not recommended and could
damage the device. Additionally, connection of the amplifier output to one of the supply rails (±V_CC) can cause
failure of the device and is not recommended. The use of Schottky diodes from each amplifier’s output to each
power supply voltage rail is recommended. This will limit surges from the transmission line so as to not damage
the THS6007.
The drivers second built-in protection feature is thermal shutdown. Should the internal junction temperature rise
above approximately 180_C, the device automatically shuts down. Such a condition could exist with improper
heat sinking or if the output is shorted to ground. When the abnormal condition is fixed and the junction
temperature drops below 150°C, the internal thermal shutdown circuit automatically turns the device back on.
thermal information
The THS6007 is packaged in a thermally-enhanced PWP package, which is a member of the PowerPAD™
family of packages. This package is constructed using a downset leadframe upon which the die is mounted
[see Figure 80(a) and Figure 80(b)]. This arrangement results in the lead frame being exposed as a thermal pad
on the underside of the package [see Figure 80(c)]. Because this thermal pad has direct thermal contact with
the die, excellent thermal performance can be achieved by providing a good thermal path away from the thermal
pad.
The PowerPAD™ package allows for both assembly and thermal management in one manufacturing operation.
During the surface-mount solder operation (when the leads are being soldered), the thermal pad can also be
soldered to a copper area underneath the package. Through the use of thermal paths within this copper area,
heat can be conducted away from the package into either a ground plane or other heat dissipating device. This
is discussed in more detail in the PCB design considerations section of this document.
The PowerPAD™ package represents a breakthrough in combining the small area and ease of assembly of
surface mount with the, heretofore, awkward mechanical methods of heatsinking.
DIE
Side View (a)
DIE
End View (b)
Thermal
Pad
Bottom View (c)
NOTE A: The thermal pad is electrically isolated from all terminals in the package.
Figure 80. Views of Thermally Enhanced PWP Package
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