SM320VC33 Datasheet, PDF (22/54 Pages) Texas Instruments – DIGITAL SIGNAL PROCESSOR

SM320VC33, SMJ320VC33
DIGITAL SIGNAL PROCESSOR
SGUS034E - FEBRUARY 2001 - REVISED OCTOBER 2002
device and development support tool nomenclature (continued)
SMJ 320 VC 33 GNM M 150
PREFIX
SMX = experimental device
TMP = prototype device
TMS = qualified device
SMJ = MIL-PRF-38535 (QML)
SMQ= QML Plastic device
SM = Commericial processing
SPEED
150 = 150 MFLOPS
DEVICE FAMILY
320 = TMS320 Family
TEMPERATURE RANGE
M = Military
TECHNOLOGY
C=
E=
F=
LC =
VC =
UC=
CMOS
CMOS EPROM
CMOS Flash EEPROM
Low-Voltage CMOS (3.3 V)
Low-Voltage CMOS [3 V (2.5 V
or 1.8 V core)]
Ultra Low-Voltage CMOS [1.8 V
(1.5 V core)]
PACKAGE TYPE^†
HFG = 164-pin ceramic QFP
GNL = 144-pin ceramic BGA, hermetic
GNM = 144-pin ceramic BGA, non-hermetic
DEVICE
3x DSP:
30
31
32
33
4x DSP:
40
44
6x DSP:
6201 6201
6701 6211
† _{QFP = Quad Flat Package}
LQFP = Low-Profile Quad Flat Package
BGA = Ball Grid Array
Figure 13. TMS320 DSP Device Nomenclature
22
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