DRV8412 Datasheet, PDF (22/28 Pages) Texas Instruments – Dual Full Bridge PWM Motor Driver

DRV8412
DRV8422
DRV8432
SLES242A – DECEMBER 2009 – REVISED DECEMBER 2009
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B1: Do not block the heat transfer path at bottom side. Clear as much space as possible for better heat spreading.
Figure 16. Printed Circuit Board – Bottom Layer
THERMAL INFORMATION
The thermally enhanced package provided with the DRV8422/32 is designed to interface directly to heat sink
using a thermal interface compound, (e.g., Ceramique from Arctic Silver, TIMTronics 413, etc.). The heat sink
then absorbs heat from the ICs and couples it to the local air. It is also a good practice to connect the heatsink to
system ground on the PCB board to reduce the ground noise.
R_θJA is a system thermal resistance from junction to ambient air. As such, it is a system parameter with the
following components:
• R_θJC (the thermal resistance from junction to case, or in this example the power pad or heat slug)
• Thermal grease thermal resistance
• Heat sink thermal resistance
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