TMS320C6745 Datasheet, PDF (205/209 Pages) Texas Instruments – Floating-point Digital Signal Processor

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TMS320C6745/6747 Floating-point Digital Signal Processor
SPRS377A – SEPTEMBER 2008 – REVISED OCTOBER 2008
7.3.2 PTP Footprint Example
PTP (S-PQFP-G176) PowerPAD™
Example Board Layout
Via pattern and copper area under solder mask
may vary depending on layout constraints
441xØ0,3
Pin 1
Solder Mask
0,5
Over Copper
Pin 1
Stencil Openings based on a stencil
thickness of .127mm (.005inch).
Reference table below for other
solder stencil thicknesses
1,35
0,5
0,25
1,0
1,0
5,1 22,0 25,5
Y 5,1
25,5
X
6,7
6,7
22,0
Solder Mask
25,5
Defined Pad
(See Note C, D)
Example
Solder Mask Opening
0,3
(See Note F)
25,5
(See Note E)
1,4
0,05
All Around
Example
Pad Geometry
CENTER POWER PAD SOLDER STENCIL OPENING
STENCIL THICKNESS
X
Y
0.1mm
5.50
7.30
0.127mm
5.10
6.70
0.152mm
4.80
6.30
0.178mm
4.50
5.90
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Customers should place a note on the circuit board fabrication drawing not to alter the center solder mask defined pad.
D. This package is designed to be soldered to a thermal pad on the board. Refer to Technical Brief, PowerPad
Thermally Enhanced Package, Texas Instruments Literature No. SLMA002, SLMA004, and also the Product Data Sheets
for specific thermal information, via requirements, and recommended board layout. These documents are available at
www.ti.com <http://www.ti.com>. Publication IPC-7351 is recommended for alternate designs.
E. Laser cutting apertures with trapezoidal walls and also rounding corners will offer better paste release. Customers should
contact their board assembly site for stencil design recommendations. Example stencil design based on a 50% volumetric
metal load solder paste. Refer to IPC-7525 for other stencil recommendations.
F. Customers should contact their board fabrication site for solder mask tolerances between and around signal pads.
PowerPAD is a trademark of Texas Instruments.
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