TIBPAL16L8-5C Datasheet, PDF (20/30 Pages) Texas Instruments – HIGH-PERFORMANCE IMPACT-X E PAL CIRCUITS

TIBPAL16R8-5C
HIGH-PERFORMANCE IMPACT-X ™ PAL^® CIRCUITS
SRPS011D – D3359, OCTOBER 1989 – REVISED SEPTEMBER 1992
THERMAL INFORMATION
thermal management of the TIBPAL16R8-5C
Thermal management of the TIBPAL16R8-5CN and TIBPAL16R8-5CFN is necessary when operating at certain
conditions of frequency, output loading, and outputs switching simultaneously. The device and system
application will determine the appropriate level of management.
Determining the level of thermal management is based on factors such as power dissipation (P_D), ambient
temperature (T_A), and transverse airflow (FPM). Figures 6 (a) and 6 (b) show the relationship between ambient
temperature and transverse airflow at given power dissipation levels. The required transverse airflow can be
determined at a particular ambient temperature and device power dissipation level in order to ensure the device
specifications.
Figure 7 illustrates how power dissipation varies as a function of frequency and the number of outputs switching
simultaneously. It should be noted that all outputs are fully loaded (C_L = 50 pF). Since the condition of eight fully
loaded outputs represents the worst-case condition, each application must be evaluated accordingly.
1000
MINIMUM TRANSVERSE AIR FLOW
vs
AMBIENT TEMPERATURE
1000
MINIMUM TRANSVERSE AIR FLOW
vs
AMBIENT TEMPERATURE
800
600
PD = 1.6 W
PD = 1.4 W
PD = 1.2 W
PD = 1 W
PD = 0.8 W
400
PD = 0.6 W
200
800
600
PD = 1.6 W
PD = 1.4 W
PD = 1.2 W
PD = 1 W
PD = 0.8 W
400 PD = 0.6 W
200
0
0 10 20 30 40 50 60 70 80
TA – Ambient Temperature – °C
(a) TIBPAL16R8-5CN
Figure 6
0
0 10 20 30 40 50 60 70 80
TA – Ambient Temperature – °C
(b) TIBPAL16R8-5CFN
20
• POST OFFICE BOX 655303 DALLAS, TEXAS 75265