TLC2274ACPW Datasheet, PDF (2/52 Pages) Texas Instruments – Advanced LinCMOSE RAIL-TO-RAIL OPERATIONAL AMPLIFIERS

TLC227x, TLC227xA
Advanced LinCMOS™ RAIL-TO-RAIL
OPERATIONAL AMPLIFIERS
SLOS190B – FEBRUARY 1997 – REVISED JULY 1999
TLC2272 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax At
25°C
SMALL
OUTLINE†
PLASTIC DIP
(P)
(D)
TSSOP‡
(PW)
0°C to 70°C
950 µV
2.5 mV
TLC2272ACD
TLC2272CD
TLC2272ACP
TLC2272CP
TLC2272CPW
– 40°C to 85°C
950 µV
2.5 mV
TLC2272AID
TLC2272ID
TLC2272AIP
TLC2272IP
—
– 40°C to 125°C
950 µV
2.5 mV
TLC2272AQD
TLC2272QD
—
TLC2272AQPW
TLC2272QPW
– 55°C to 125°C
950 µV
2.5 mV
TLC2272AMD
TLC2272MD
TLC2272AMP
TLC2272MP
—
† _{The D packages are available taped and reeled. Add R suffix to the device type (e.g., TLC2272CDR).}
‡ _{The PW package is available taped and reeled. Add R suffix to the device type (e.g., TLC2272PWR).}
§ _{Chips are tested at 25°C.}
TLC2274 AVAILABLE OPTIONS
TA
VIOmax AT
25°C
SMALL
OUTLINE†
(D)
CHIP
CARRIER
(FK)
PACKAGED DEVICES
CERAMIC
DIP
(J)
PLASTIC
DIP
(N)
0°C to
70°C
950 µV
2.5 mV
TLC2274ACD
TLC2274CD
—
—
TLC2274ACN
TLC2274CN
– 40°C to
85°C
950 µV
2.5 mV
TLC2274AID
TLC2274ID
—
—
TLC2274AIN
TLC2274IN
– 40°C to
125°C
950 µV
2.5 mV
TLC2274AQD
TLC2274QD
—
—
—
– 55°C to
125°C
950 µV
2.5 mV
TLC2274AMD
TLC2274MD
TLC2274AMFK
TLC2274MFK
TLC2274AMJ
TLC2274MJ
TLC2274AMN
TLC2274MN
† _{The D packages are available taped and reeled. Add R suffix to device type (e.g., TLC2274CDR).}
‡ _{The PW package is available taped and reeled.}
§ _{Chips are tested at 25°C.}
TSSOP‡
(PW)
—
TLC2274CPW
—
TLC2274IPW
—
—
TLC2272
D, P, OR PW PACKAGE
(TOP VIEW)
1OUT 1
1IN – 2
1IN + 3
V_{DD –} /GND 4
8 V_{DD +}
7 2OUT
6 2IN –
5 2IN +
TLC2274
D, J, N, OR PW PACKAGE
(TOP VIEW)
1OUT ₁
1IN – ₂
1IN + 3
V_{DD +} 4
2IN + 5
2IN – 6
2OUT 7
14 4OUT
13 4IN –
12 4IN +
11 V_{DD –}
10 3IN +
9 3IN –
8 3OUT
TLC2274
FK PACKAGE
(TOP VIEW)
1IN +
NC
V_{DD +}
NC
2IN +
3 2 1 20 19
4
18
5
17
6
16
7
15
8
14
9 10 11 12 13
4IN +
NC
V_{DD –}
NC
3IN +
NC – No internal connection
2
• POST OFFICE BOX 655303 DALLAS, TEXAS 75265