LP3878-ADJ_15 Datasheet, PDF (2/25 Pages) Texas Instruments – Micropower 800-mA Low-Noise

LP3878-ADJ
SNVS311D – MAY 2005 – REVISED FEBRUARY 2015
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information .................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Typical Characteristics .............................................. 6
7 Detailed Description ............................................ 11
7.1 Overview ................................................................. 11
7.2 Functional Block Diagram ....................................... 11
7.3 Feature Description................................................. 11
7.4 Device Functional Modes........................................ 12
8 Application and Implementation ........................ 13
8.1 Application Information............................................ 13
8.2 Typical Application ................................................. 13
9 Power Supply Recommendations...................... 17
10 Layout................................................................... 17
10.1 Layout Guidelines ................................................. 17
10.2 Layout Example .................................................... 17
10.3 Power Dissipation ................................................. 17
11 Device and Documentation Support ................. 18
11.1 Documentation Support ........................................ 18
11.2 Trademarks ........................................................... 18
11.3 Electrostatic Discharge Caution ............................ 18
11.4 Glossary ................................................................ 18
12 Mechanical, Packaging, and Orderable
Information ........................................................... 18
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (December 2014) to Revision D
Page
• Deleted trademark symbol from VIP - no longer trademark; add reference design icon to Top Navigators.......................... 1
• Deleted soldering info - now in POA ..................................................................................................................................... 4
• Changed wording of footnote 5 to Ab Max Ratings ............................................................................................................... 4
• Changed I_OUT to I_OUT throughout document............................................................................................................................ 5
• Changed wording of Reverse Input-Output Voltage ............................................................................................................ 11
• Changed outpin pin to OUT pin ........................................................................................................................................... 15
• Added new paragraph to Noise Bypass Capacitor subsection ........................................................................................... 15
Changes from Revision B (April 2013) to Revision C
Page
• Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section; update
thermal values ....................................................................................................................................................................... 1
Changes from Revision A (April 2013) to Revision B
Page
• Changed layout of National Data Sheet to TI format ........................................................................................................... 16
2
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