DAC8803 Datasheet, PDF (2/30 Pages) Texas Instruments – Quad, Current Output, Serial Input 14-Bit Multiplying Digital-to-Analog Converter

DAC8803
SBAS340A – JANUARY 2005 – REVISED APRIL 2005
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated
circuits be handled with appropriate precautions. Failure to observe proper handling and installation
procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION⁽¹⁾
PRODUCT
MINIMUM
RELATIVE
ACCURACY
(LSB)
DAC8803
±1
DIFFERENTIAL
NONLINEARITY
(LSB)
±1
SPECIFIED
TEMPERATURE
RANGE
-40°C to +85°C
PACKAGE-
LEAD
SSOP-28
PACKAGE
DESIGNATOR
DB
ORDERING
NUMBER
DAC8803IDBT
DAC8803IDBR
TRANSPORT
MEDIA
QUANTITY
Tape and Reel, 250
Tape and Reel, 2500
(1) For the most current specifications and package information, see the Package Option Addendum at the end of this document, or see the
TI website at www.ti.com
ABSOLUTE MAXIMUM RATINGS⁽¹⁾
V_DD to GND
V_SS to GND
V_REF to GND
Logic inputs and output to GND
V(I_OUT) to GND
A_GNDX to DGND
Input current to any pin except supplies
Package power dissipation
Thermal resistance, θ_JA
28-Lead shrink surface-mount (RS-28)
Maximum junction temperature (T_Jmax)
Operating temperature range, Model A
Storage temperature range
Lead temperature
RS-28 (Vapor phase 60s)
Lead temperature
RS-28 (Infrared 15s)
DAC8803
-0.3 to +8
-0.3 to -7
-18 to +18
-0.3 to +8
-0.3 to V_DD + 0.3
-0.3 to +0.3
±50
(T_Jmax - T_A)/θ_JA
100
150
-40 to +85
-65 to +150
215
220
UNIT
V
V
V
V
V
V
mA
°C/W
°C
°C
°C
°C
°C
(1) Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. This is a stress rating only;
functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification
is not implied. Exposure to absolute maximum conditions for extended periods may affect device reliability.
2