CC2545_15 Datasheet, PDF (2/31 Pages) Texas Instruments – System-on-Chip for 2.4-GHz RF Applications

CC2545
SWRS106B – JUNE 2012 – REVISED FEBRUARY 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
DESCRIPTION
The CC2545 is an optimized system-on-chip (SoC) solution with data rates up to 2Mbps built with low bill-of-
material cost. The CC2545 combines the excellent performance of a leading RF transceiver with a single-cycle
8051 compliant CPU, 32-KB in-system programmable flash memory, up to 1-KB RAM, 31 General-Purpose I/O
pins and many other powerful features. The CC2545 has efficient power modes with RAM and register retention
below 1 μA, making it highly suited for low-duty-cycle systems where ultralow power consumption is required.
Short transition times between operating modes further ensure low energy consumption.
The CC2545 is compatible with the CC2541/CC2543/CC2544. It comes in a 7-mm × 7-mm QFN48 package, with
SPI/UART/I2C interface. The CC2545 comes complete with reference designs from Texas Instruments.
The device targets wireless consumer and HID applications. The CC2545 is tailored for peripheral devices such
as wireless keyboards.
For block diagram, see Figure 7
ABSOLUTE MAXIMUM RATINGS⁽¹⁾
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
Supply voltage VDD
All supply pins must have the same voltage
Voltage on any digital pin
Input RF level
Storage temperature range
ESD ⁽²⁾
All pads, according to human-body model, JEDEC
STD 22, method A114 (HBM)
According to charged-device model, JEDEC STD
22, method C101 (CDM)
MIN
MAX
UNIT
–0.3
3.9
V
–0.3
VDD+0.3 <= 3.9
V
10
dBm
–40
125
°C
2000
V
750
V
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) CAUTION: ESD sensitive device. Precaution should be used when handing the device in order to prevent permanent damage.
RECOMMENDED OPERATING CONDITIONS
PARAMETER
TEST CONDITIONS
Operating ambient temperature range, T_A
Operating supply voltage VDD
All supply pins must have same voltage
MIN
MAX
UNIT
–40
85
°C
2.0
3.6
V
2
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