BQ24180 Datasheet, PDF (2/39 Pages) Texas Instruments – Fully Integrated Switch-Mode One-Cell Li-Ion Charger with Full USB Compliance and Accessory Power Connection

bq24180
SLUSA02 A – FEBRUARY 2010 – REVISED FEBRUARY 2010
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
DESCRIPTION (CONTINUED)
The bq24180 charges the battery in three phases: conditioning, constant current and constant voltage. Charge
current is programmable using the I²C interface. Additionally, the input current can be limited to a host
programmable threshold to maintain maximum charge current from current-limited sources, such as USB ports.
Charge is terminated based on user-selectable minimum current level. A software watchdog provides a safety
backup for I²C interface while a safety timer prevents overcharging the battery. During normal operation,
bq24180 automatically restarts the charge cycle if the battery voltage falls below an internal threshold and
automatically enters sleep mode or high impedance mode when the input supply is removed. The charge status
is reported to the host using the I²C interface. During the charging process, the bq24180 monitors its junction
temperature (T_J) and reduces the charge current if T_J increases to 125°C. The bq24180 is available in 25-pin
WCSP package.
PART NUMBER ⁽¹⁾⁽²⁾
bq24180YFFR
bq24180YFFT
ORDERING INFORMATION
V_OVP
16.5 V
16.5 V
I²C ADDRESS
6B
6B
(1) The YFF package is available in the following options:
R – taped and reeled in quantities of 3,000 devices per reel.
T – taped and reeled in quantities of 250 devices per reel.
(2) This product is RoHS compatible, including a lead concentration that does not exceed 0.1% of total product weight, and is suitable for
use in specified lead-free soldering processes. In addition, this product uses package materials that do not contain halogens, including
bromine (Br) or antimony (Sb) above 0.1% of total product weight.
ABSOLUTE MAXIMUM RATINGS⁽¹⁾⁽²⁾
over operating free-air temperature range (unless otherwise noted)
LIMITS
UNIT
Supply voltage range (with respect to PGND)
VBUS
–2 to 20
V
Input voltage range (with respect to and PGND)
SCL, SDA, PSEL, CSIN, CSOUT, DRV, DCOUT, INT
–0.3 to 7
V
Output voltage range (with respect to and PGND)
PMID, STAT
SW, BOOT
–0.3 to 20
V
–0.7 to 20
Voltage difference between CSIN and CSOUT inputs (VCSIN –VCSOUT)
±7
V
Voltage difference between BOOT and SW inputs (VBOOT –VSW)
–0.3 to 7
V
Output sink
INT
STAT
5
mA
10
Output current
DCOUT
1.5
A
DRV
10
mA
Output current (average)
SW
2
A
T_A
Operating free-air temperature range
T_J
Junction temperature range
T_stg
Storage temperature
–30 to +85
°C
–40 to +125
°C
–45 to +150
°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to GND if not specified. Currents are positive into, negative out of the specified terminal. Consult Packaging
Section of the data book for thermal limitations and considerations of packages.
2
Submit Documentation Feedback
Product Folder Link(s): bq24180
Copyright © 2010, Texas Instruments Incorporated