AMC1204-Q1_15 Datasheet, PDF (2/33 Pages) Texas Instruments – 20 MHz, Second-Order, Isolated Delta-Sigma Modulator for Current-Shunt Measurement

AMC1204-Q1
SLAS886B – JULY 2012 – REVISED JANUARY 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERABLE
PART NUMBER⁽²⁾
AMC1204QDWRQ1
MODULATOR
CLOCK (MHz)
20
ORDERING INFORMATION⁽¹⁾
DIGITAL SUPPLY CLOCK SOURCE
3 V, 3.3 V, or 5 V
External
INL (LSB)
±8
GAIN ERROR
(%)
±2.5
THD (dB)
–80
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or visit the
device product folder on www.ti.com
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
ABSOLUTE MAXIMUM RATINGS⁽¹⁾
Over the operating ambient temperature range, unless otherwise noted.
PARAMETER
Supply voltage, AVDD to AGND or DVDD to DGND
Analog input voltage at VINP, VINN
Digital input voltage at CLKIN
Input current to any pin except supply pins
Maximum virtual junction temperature, T_J
Operating ambient temperature range, T_OA
Electrostatic discharge
(ESD),
all pins
Human body model (HBM) AEC-Q100 Classification
Level H2
Charged device model (CDM) AEC-Q100 Classification
Level C3B
AMC1204-Q1
MIN
MAX
–0.3
6
AGND – 0.5
AVDD + 0.5
DGND – 0.3
DVDD + 0.3
–10
10
150
–40
125
–2000
2000
–750
750
UNIT
V
V
V
mA
°C
°C
V
V
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under the Electrical Characteristics
is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
THERMAL INFORMATION
THERMAL METRIC⁽¹⁾
θ_JA
θ_JCtop
θ_JB
ψ_JT
ψ_JB
θ_JCbot
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
AMC1204-Q1
DW (16 PINS)
78.5
41.3
50.2
11.5
41.2
n/a
UNIT
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
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