TMS320VC5501 Datasheet, PDF (188/193 Pages) Texas Instruments – TMS320VC5501 Fixed-Point Digital Signal Processor

Mechanical Data
Table 6−1. Thermal Resistance Characteristics (Ambient) (Continued)
PACKAGE
R_θJA (°C/W)
60
BOARD TYPE†
High-K
AIRFLOW (LFM)
0
52
High-K
150
49
High-K
250
PGF
45
High-K
500
104
Low-K
0
81
Low-K
150
73
Low-K
250
64
Low-K
500
† _{Board types are as defined by JEDEC. Reference JEDEC Standard JESD51−9, Test Boards for Area Array Surface Mount Package Thermal}
Measurements.
‡ _{Adding thermal vias will significantly improve the thermal performance of the device. To use the thermal balls on the GZZ and ZZZ packages:}
− An array of 25 land pads must be added on the top layer of the PCB where the package will be mounted.
− The PCB land pads should be the same diameter as the vias in the package substrate for optimal Board Level Reliability Temperature Cycle
performance.
− The land pads on the PCB should be connected together and to PCB through-holes. The PCB through-holes should in turn be connected
to the ground plane for heat dissipation.
− A solid internal plane is preferred for spreading the heat.
Refer to the MicroStar BGAE Packaging Reference Guide (literature number SSYZ015) for guidance on PCB design, surface mount, and
reliability considerations.
Table 6−2. Thermal Resistance Characteristics (Case)
PACKAGE
R_θJC (°C/W)
BOARD TYPE†
GZZ, ZZZ
22
2s JEDEC Test Card
PGF
13.2
2s JEDEC Test Card
† _{Board types are as defined by JEDEC. Reference JEDEC Standard JESD51−9, Test Boards for Area Array Surface}
Mount Package Thermal Measurements.
188 SPRS206H
December 2002 − Revised November 2004