AM3359_12 Datasheet, PDF (147/195 Pages) Texas Instruments – AM335x ARM® Cortex™-A8 Microprocessors (MPUs)

AM3359, AM3358, AM3357
AM3356, AM3354, AM3352
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SPRS717B – OCTOBER 2011 – REVISED JANUARY 2012
5.4.2.2.2.4 Placement
Figure 5-36 shows the required placement for the DDR2 devices. The dimensions for this figure are
defined in Table 5-40. The placement does not restrict the side of the PCB on which the devices are
mounted. The ultimate purpose of the placement is to limit the maximum trace lengths and allow for
proper routing space. For single-memory DDR2 systems, the second DDR2 device is omitted from the
placement.
X
A1
Y
OFFSET
Y
DDR2
Device
Y
OFFSET
A1
AM335x
Recommended DDR2
Device Orientation
Figure 5-36. AM335x Device and DDR2 Device Placement
Table 5-40. Placement Specifications⁽¹⁾
NO.
PARAMETER
1 X⁽²⁾⁽³⁾
2 Y⁽²⁾⁽³⁾
3 Y Offset^(2)(3)(4)
4 Clearance from non-DDR2 signal to DDR2 keepout region⁽⁵⁾⁽⁶⁾
MIN
MAX UNIT
1750 mils
1280 mils
650 mils
4
w
(1) DDR2 keepout region to encompass entire DDR2 routing area.
(2) For dimension definitions, see Figure 5-36.
(3) Measurements from center of AM335x device to center of DDR2 device.
(4) For single-memory systems, it is recommended that Y offset be as small as possible.
(5) w is defined as the signal trace width.
(6) Non-DDR2 signals allowed within DDR2 keepout region provided they are separated from DDR2 routing layers by a ground plane.
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Peripheral Information and Timings 147
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