TMS320VC5505 Datasheet, PDF (138/141 Pages) Texas Instruments – Fixed-Point Digital Signal Processor

TMS320VC5505
Fixed-Point Digital Signal Processor
SPRS503A – JUNE 2009 – REVISED JULY 2009
7 Mechanical Packaging and Orderable Information
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The following table(s) show the thermal resistance characteristics for the PBGA–ZCH mechanical
package.
7.1 Thermal Data for ZCH
Table 7-1. Thermal Resistance Characteristics (PBGA Package) [ZCH]
NO.
＝C/W ⁽¹⁾
AIR FLOW
(m/s) ⁽²⁾
1 RΘ_JC
2
RΘ_JB
Junction-to-case
Junction-to-board
1S0P
1S0P
2S2P
6.74
N/A
14.5
N/A
13.8
3
RΘ_JA
Junction-to-free air
1S0P
2S2P
57.0
0.00
33.4
4
0.50
5
1.00
6
RΘ_JMA
Junction-to-moving air
2.00
7
3.00
8
0.09
0.00
9
0.50
10 Psi_JT
Junction-to-package top
1.00
11
2.00
12
3.00
13
13.7
0.00
14
0.50
15 Psi_JB
Junction-to-board
1.00
16
2.00
17
3.00
(1) These measurements were conducted in a JEDEC defined 2S2P system and will change based on environment as well as application.
For more information, see these EIA/JEDEC standards – EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment
Conditions - Natural Convection (Still Air) and JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount
Packages.
(2) m/s = meters per second
7.1.1 Packaging Information
The following packaging information and addendum reflect the most current data available for the
designated device(s). This data is subject to change without notice and without revision of this document.
138 Mechanical Packaging and Orderable Information
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