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BQ4010_07 Datasheet, PDF (13/18 Pages) Texas Instruments – 8 k x 8 NONVOLATILE SRAM (5 V, 3.3 V)
bq4010/Y/LY
www.ti.com
SLUS116A – MAY 1999 – REVISED APRIL 2007
Table 4. 5-V POWER-DOWN/POWER-UP (TA = TOPR)
PARAMETER
TEST CONDITIONS
MIN TYP(1) MAX UNIT
tPF
VCC slew, 4.75 to 4.25 V
tFS
VCC slew, 4.25 to VSO
tPU
VCC slew, VSO to VPFD (max.)
300
µs
10
µs
0
µs
tCER
Chip enable recovery time
Time during which SRAM is write-protected after
VCC passes VPFD on power-up.
tDR
Data-retention time in absence of VCC TA = 25°C(2)
40
80 120 ms
10
years
tWPT
Write-protect time
Delay after VCC slews down past VPFD before SRAM
is writeprotected.
40 100 150 µs
(1) Typical values indicate operation at TA = 25°C, VCC = 5V.
(2) Batteries are disconnected from circuit until after VCC is applied for the first time. tDR is the accumulated time in absence of power
beginning when power is first applied to the device.
VCC
CE
tPF
4.75 V
VPFD
tFS
tWPT
4.25 V
VSO
VSO
tDR
VPFD
tPU
tCER
Figure 10. 5-V Power-Down/Power-Up Timing
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